Hesion Dongguanhengsheng

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Wafer packaging system

Email:

hesion@foxmail.com

Tel: 86-769-82324106

  • Detailed description

  • 　　 eJR Canister Wafer Packaging Box
    　　Technical Specifications:
    　　Adaptable to 6/8/12 inch wafers, packaging density increased by 40% (compared to traditional solutions)
    　　Material: ESD COP (anti-static cycloolefin polymer), TVOC < 0.1ppm (SEMI G78)
    　　Anti-static design: Surface resistance 10⁶~10⁹Ω, embedded RFID tracking module
    　　Core Value: Reduce wafer processing costs by 15%, compatible with fully automated AMHS systems
    　　 eCT Standard Wafer Packaging Box
    　　Innovative Design:
    　　Protective structure for ultra-thin wafers (thickness < 100μm), breakage rate < 0.001%
    　　Multi-layer composite buffer system, impact resistance up to 50G (MILSTD883)
    　　Industry Certifications: SEMI E15.1, JEDEC MS034
    　　 Vacuum Moisture-proof Aluminum Foil Bag
    　　Three-layer, four-layer or five-layer co-extrusion technology optional:
    　　WVTR < 0.1g/m²·day (ASTM F1249), OTR < 0.5cm³/m²·day
    　　Integrated humidity indicator card (HIC), accuracy ±2%RH
    　　Anti-static upgrade: Excellent anti-static performance on the surface of the bag, resistance value: 105~1011Ω

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We provide you with standardized products, develop customized products, and provide solutions to meet the diverse needs of customers

Service Hotline

86-769-82324106

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Company Address: No. 691, Huanchang North Road, Changping Town, Dongguan City, Guangdong Province, Building 1, Floor 1, Shangshang Industrial Park

Email:hesion@foxmail.com

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