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Wafer fabrication supporting products

  • Detailed description
  •    Wafer Isolation Anti-static PE Pad
      Technical Characteristics
      Surface resistivity 10⁶~10⁹Ω (ASTM D257), electrostatic decay time <0.1 seconds (ESD S20.20)
      Tear strength 15N/mm² (ISO 341), resistant to IPA, acetone and other solvents
      Cleanliness: Particle release <5 particles/cm2 (≥0.5μm, IEST-STD-CC1246D)
      Application scenarios: Buffer isolation in wafer boxes, lithography process protection, photovoltaic silicon wafer transportation
       Wafer Isolation Anti-static Tyvek® Pad
      Technological Breakthroughs:
      Using DuPont Tyvek® 1056D material, thickness 0.16mm, air permeability 0.1cfm/ft² (ASTM D737)
      Chemical inertness: Acid and alkali resistant (pH 1~14), passed ISO 10993 biocompatibility certification
      Lightweight design: Weight only 45g/m², bending life >20,000 times (ASTM F392)
      Application scenarios: EUV reticle box protection, sterile packaging of medical chips
       Wafer Isolation Foam Buffer Pad
      Performance Advantages:
      Buffer efficiency >90% (ASTM D3574), compression deformation <10% (25% compression rate)
      Customizable thickness: 1/3/6/10mm (tolerance ±0.1mm)
      Application scenarios: Wafer cross-border transportation protection, pressure balance in power battery formation process