- Detailed description
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Wafer Isolation Anti-static PE Pad
Technical Characteristics
Surface resistivity 10⁶~10⁹Ω (ASTM D257), electrostatic decay time <0.1 seconds (ESD S20.20)
Tear strength 15N/mm² (ISO 341), resistant to IPA, acetone and other solvents
Cleanliness: Particle release <5 particles/cm2 (≥0.5μm, IEST-STD-CC1246D)
Application scenarios: Buffer isolation in wafer boxes, lithography process protection, photovoltaic silicon wafer transportation
Wafer Isolation Anti-static Tyvek® Pad
Technological Breakthroughs:
Using DuPont Tyvek® 1056D material, thickness 0.16mm, air permeability 0.1cfm/ft² (ASTM D737)
Chemical inertness: Acid and alkali resistant (pH 1~14), passed ISO 10993 biocompatibility certification
Lightweight design: Weight only 45g/m², bending life >20,000 times (ASTM F392)
Application scenarios: EUV reticle box protection, sterile packaging of medical chips
Wafer Isolation Foam Buffer Pad
Performance Advantages:
Buffer efficiency >90% (ASTM D3574), compression deformation <10% (25% compression rate)
Customizable thickness: 1/3/6/10mm (tolerance ±0.1mm)
Application scenarios: Wafer cross-border transportation protection, pressure balance in power battery formation process