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Profile
Hesion is proud to have clients like you, and we will do our best to provide you with excellent service and become your loyal partner and friend!
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Product
TENS electrode film; conductive carbon film; PE conductive film; anti-static shielding film; anti-static film; anti-static shielding bag; anti-static bag; conductive bag; conductive grid bag; automatic packaging bag; PET anti-static film; conductive tape; plastic packaging; anti-static plastic; transparent conductive sheet; anti-static plastic stationery.
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Cases
Functional films; shielding materials; plastic sheets; anti-static conductive plastic films; electronic product packaging; plastic packaging products.
Application Cases
- Detailed description
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HESION Dongguan Hengsheng anti-static silicon wafer PS isolation pads are anti-static packaging materials specially designed for semiconductor wafers. They are mainly used to prevent electrostatic accumulation and discharge from damaging wafers during storage, transportation, and processing.
Product Description:
1. Material and Properties:
• This product is mainly made of anti-static polystyrene (PS) material. It undergoes special processing to give the material good electrostatic dissipation performance. The surface resistivity is typically controlled between 10^6 and 10^9 ohms/square to effectively prevent electrostatic accumulation.
• PS material itself has good mechanical properties, such as moderate hardness, impact resistance, lightness, and easy processing and molding, suitable for the precise packaging needs of wafers.
2. Product Design:
• The anti-static wafer PS isolation pad is well-designed and can be customized according to the wafer size to precisely match the wafer profile, ensuring the stability of the wafer after packaging.
• The product has good cleanliness and is suitable for cleanroom environments to avoid secondary contamination of the wafer.
• The surface of the pad may have undergone special treatment, such as matte or textured design, to reduce the risk of scratching the wafer surface.
3. Application Range:
• Mainly used for temporary storage and transportation of semiconductor wafers in the production process, as well as positioning and protection within wafer boxes.
• It can also be used for loading wafers onto processing equipment as a temporary electrostatic protection isolation layer.
4. Usage and Maintenance:
• Ensure good contact between the pad and the wafer during use, and that the entire packaging system is well-grounded to ensure effective electrostatic dissipation.
• It should be used in a clean environment, following cleanroom operating procedures to avoid contaminating the pad and wafer.
• If necessary, the pads can be cleaned and disinfected according to usage and cleaning procedures.
5. Specifications and Customization:
• According to different wafer sizes, anti-static wafer PS isolation pads offer a variety of customized specifications, including but not limited to diameter, thickness, and shape.
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