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Profile
Hesion is proud to have clients like you, and we will do our best to provide you with excellent service and become your loyal partner and friend!
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Product
TENS electrode film; conductive carbon film; PE conductive film; anti-static shielding film; anti-static film; anti-static shielding bag; anti-static bag; conductive bag; conductive grid bag; automatic packaging bag; PET anti-static film; conductive tape; plastic packaging; anti-static plastic; transparent conductive sheet; anti-static plastic stationery.
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Cases
Functional films; shielding materials; plastic sheets; anti-static conductive plastic films; electronic product packaging; plastic packaging products.
Application Cases
- Detailed description
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HESION Dongguan Hengsheng ESD specializes in the production of anti-static wafer interleaving paper, a special paper material designed to prevent electrostatic accumulation and discharge during the manufacturing, storage, and transportation of semiconductor wafers.
Product Description of Anti-Static Wafer Interleaving Paper:
1. Material and Structure:
• Anti-static wafer interleaving paper mainly uses high-quality wood pulp paper or dust-free paper as the base material. Conductive fibers or anti-static agents are added to provide good anti-static properties.
• The surface resistivity is usually controlled between 10^8 and 10^11 ohms/square to ensure effective dissipation and release of static charges, preventing damage to the wafer.
2. Product Features:
• Stable anti-static performance, maintaining its anti-static function in dry or humid environments.
• Dust-free and residue-free, suitable for cleanroom environments, ensuring the wafer remains uncontaminated during use.
• Possesses a certain degree of flexibility, allowing for appropriate folding and unfolding according to the wafer's shape without scratching the wafer.
• Some products also have high tensile strength and tear resistance, ensuring stability during use and handling.
3. Application Range:
• Used in semiconductor wafer production to isolate wafers, preventing electrostatic generation from contact between wafers.
• Used as anti-static packaging material during wafer storage and transportation to prevent electrostatic discharge damage.
• Used for internal filling in wafer boxes to protect wafers from collisions and abrasion.
4. Specifications and Customization:
• Anti-static wafer interleaving paper comes in various specifications, usually customized according to wafer diameter and thickness to meet the needs of different wafer sizes.
• Customized services such as different colors (e.g., black), patterns, and labels are available upon customer request.
5. Usage and Maintenance:
• Ensure good contact between the interleaving paper, the wafer, and the surrounding environment during use. If necessary, connect it to an effective grounding system.
• Maintain a clean environment during storage and use to prevent dust and contaminants from affecting the performance of the interleaving paper.
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Company Address: No. 691, Huanchang North Road, Changping Town, Dongguan City, Guangdong Province, Building 1, Floor 1, Shangshang Industrial Park
Email:hesion@foxmail.com
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