HS HE1005A B Yellow dust-free isolation paper, round
HS HE1005A B Yellow dust-free isolation paper, round
HS HE1005A B Yellow dust-free isolation paper, round
HS HE1005A B Yellow dust-free isolation paper, round
HS HE1005A B Yellow dust-free isolation paper, round
HS HE1005A B Yellow dust-free isolation paper, round
HS HE1005A B Yellow dust-free isolation paper, round
HS HE1005A B Yellow dust-free isolation paper, round
HS HE1005A B Yellow dust-free isolation paper, round
HS HE1005A B Yellow dust-free isolation paper, round
HS HE1005A B Yellow dust-free isolation paper, round
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  • HS HE1005A B Yellow dust-free isolation paper, round
  • HS HE1005A B Yellow dust-free isolation paper, round
  • HS HE1005A B Yellow dust-free isolation paper, round
  • HS HE1005A B Yellow dust-free isolation paper, round
  • HS HE1005A B Yellow dust-free isolation paper, round
  • HS HE1005A B Yellow dust-free isolation paper, round
  • HS HE1005A B Yellow dust-free isolation paper, round
  • HS HE1005A B Yellow dust-free isolation paper, round
  • HS HE1005A B Yellow dust-free isolation paper, round
  • HS HE1005A B Yellow dust-free isolation paper, round
  • HS HE1005A B Yellow dust-free isolation paper, round

HS HE1005A B Yellow dust-free isolation paper, round

  • Detailed description
  •   HESION Dongguan Hengsheng ESD specializes in the production of anti-static wafer interleaving paper, a special paper material designed to prevent electrostatic accumulation and discharge during the manufacturing, storage, and transportation of semiconductor wafers.
       Product Description of Anti-Static Wafer Interleaving Paper:
      1. Material and Structure:
      • Anti-static wafer interleaving paper mainly uses high-quality wood pulp paper or dust-free paper as the base material. Conductive fibers or anti-static agents are added to provide good anti-static properties.
      • The surface resistivity is usually controlled between 10^8 and 10^11 ohms/square to ensure effective dissipation and release of static charges, preventing damage to the wafer.
      2. Product Features:
      • Stable anti-static performance, maintaining its anti-static function in dry or humid environments.
      • Dust-free and residue-free, suitable for cleanroom environments to ensure the wafer remains uncontaminated during use.
      • Possesses a certain degree of flexibility, allowing for appropriate folding and unfolding according to the wafer's shape without scratching the wafer.
      • Some products also have certain tensile strength and tear resistance to ensure stability during use and handling.
      3. Application Range:
      • Used in the production of semiconductor wafers to isolate wafers from each other, preventing electrostatic generation from contact.
      • Used as anti-static packaging material during wafer storage and transportation to prevent electrostatic discharge damage.
      • Used for internal filling in wafer boxes to protect wafers from collisions and abrasion.
      4. Specifications and Customization:
      • Anti-static wafer interleaving paper comes in various specifications, usually customized according to wafer diameter and thickness to meet the needs of different wafer sizes.
      • Customized services such as different colors (e.g., black), patterns, and labels are available upon customer request.
      5. Usage and Maintenance:
      • Ensure good contact between the interleaving paper, the wafer, and the surrounding environment during use. If necessary, connect it to an effective grounding system.
      • Maintain a clean environment during storage and use to avoid the impact of dust and contaminants on the performance of the interleaving paper.