Hesion Dongguanhengsheng

Application Cases

Semiconductor

Military industry

New energy

HS HE1003 white dust-free isolation paper
HS HE1003 white dust-free isolation paper
HS HE1003 white dust-free isolation paper
HS HE1003 white dust-free isolation paper
HS HE1003 white dust-free isolation paper
HS HE1003 white dust-free isolation paper
HS HE1003 white dust-free isolation paper
HS HE1003 white dust-free isolation paper
HS HE1003 white dust-free isolation paper
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  • HS HE1003 white dust-free isolation paper
  • HS HE1003 white dust-free isolation paper
  • HS HE1003 white dust-free isolation paper
  • HS HE1003 white dust-free isolation paper
  • HS HE1003 white dust-free isolation paper
  • HS HE1003 white dust-free isolation paper
  • HS HE1003 white dust-free isolation paper
  • HS HE1003 white dust-free isolation paper
  • HS HE1003 white dust-free isolation paper

HS HE1003 white dust-free isolation paper

Email:

hesion@foxmail.com

Tel: 86-769-82324106

  • Detailed description

  • 　　HESION Dongguan Hengsheng ESD specializes in the production of anti-static wafer interleaving paper, a special paper material designed to prevent electrostatic accumulation and discharge during the manufacturing, storage, and transportation of semiconductor wafers.
    　 　Product Description of Anti-Static Wafer Interleaving Paper:
    　　1. Material and Structure:
    　　• Anti-static wafer interleaving paper mainly uses high-quality wood pulp paper or dust-free paper as the base material. Conductive fibers or anti-static agents are added to provide good anti-static properties.
    　　• Surface resistivity is typically controlled between     10^8 and 10^11 ohms/square to ensure effective dissipation and release of static charges, preventing damage to the wafers.
    　　2. Product Features:
    　　• Stable anti-static performance, maintaining anti-static effects in dry or humid environments.
    　　• Dust-free and residue-free, suitable for cleanroom environments, ensuring wafers remain uncontaminated during use.
    　　• Possesses a certain degree of flexibility, allowing for appropriate folding and unfolding according to the wafer shape without scratching the wafer.
    　　• Some products also have certain tensile strength and tear resistance, ensuring stability during use and handling.
    　　3. Application Range:
    　　• Used in semiconductor wafer production to isolate wafers, preventing electrostatic generation from contact between wafers.
    　　• Used as anti-static packaging material during wafer storage and transportation to prevent electrostatic discharge damage to wafers.
    　　• Used for internal filling in wafer boxes to protect wafers from collisions and abrasion.
    　　4. Specifications and Customization:
    　　• Anti-static wafer interleaving paper comes in various specifications, usually customized according to wafer diameter and thickness to meet the needs of different wafer sizes.
    　　• Customized services such as different colors (e.g., black), patterns, and labels are available according to customer needs.
    　　5. Usage and Maintenance:
    　　• Ensure good contact between the interleaving paper, the wafer, and the surrounding environment during use. If necessary, connect to an effective grounding system.
    　　• Maintain a clean environment during storage and use to avoid the impact of dust and contaminants on the performance of the interleaving paper.

Let's stay in touch!

We provide you with standardized products, develop customized products, and provide solutions to meet the diverse needs of customers

Service Hotline

86-769-82324106

Inquire Now
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Company Address: No. 691, Huanchang North Road, Changping Town, Dongguan City, Guangdong Province, Building 1, Floor 1, Shangshang Industrial Park

Email:hesion@foxmail.com

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