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Profile
Hesion is proud to have clients like you, and we will do our best to provide you with excellent service and become your loyal partner and friend!
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Product
TENS electrode film; conductive carbon film; PE conductive film; anti-static shielding film; anti-static film; anti-static shielding bag; anti-static bag; conductive bag; conductive grid bag; automatic packaging bag; PET anti-static film; conductive tape; plastic packaging; anti-static plastic; transparent conductive sheet; anti-static plastic stationery.
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Cases
Functional films; shielding materials; plastic sheets; anti-static conductive plastic films; electronic product packaging; plastic packaging products.
Application Cases
HE1001 Black Anti-Static Wafer Isolation Film HSW-002
- Detailed description
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Fifth-power® wafer pads are also known as anti-static pads, anti-static sheets, conductive separators, black wafer separators, anti-static wafer separators, conductive wafer separators, wafer separators, black wafer pads, black wafer separators, round wafer pads, round wafer separators, and wafer squares. Additionally, according to their surface treatment process, they are also called anti-static black textured wafer pads, black wafer anti-slip isolation pads, textured wafer squares, etc.
Black anti-static wafer isolation films are specialized thin-film materials that provide electrostatic protection for semiconductor wafers during manufacturing, processing, transportation, and storage. Static charges accumulated on wafers and semiconductor chips placed on the wafer pad can be instantly discharged through the film, protecting sensitive electronic components from damage caused by electromagnetic waves and static electricity.
Detailed introduction:
1. Material and structure:
• Primarily made of high-quality polyethylene (PE) and other high-performance polymers as the base material. Conductive fillers are added or surface treatments are applied through special processes to provide excellent anti-static properties.
• Surface resistivity is typically controlled between 10^6 and 10^9 ohms/square. Static discharge time: <1.0 sec. The film itself is electrostatically conductive material, not a surface coating.
• Processing technology. The pad has a vertically penetrating electrostatic prevention function to ensure effective dissipation of static electricity, preventing damage to wafers caused by electrostatic attraction or discharge between wafers.
2. Product features:
• Black design: In addition to anti-static functionality, the black color reduces reflection, which helps avoid visual interference in dark environments and visually facilitates clear distinction between wafers.
• Thin-film texture: The film is thin and flexible, allowing it to closely adhere to the wafer surface without damaging the wafer during peeling.
• High cleanliness: The product's cleanliness is strictly controlled during production to meet the high cleanliness standards of the semiconductor industry. The surface is smooth, non-powdering, and dust-free.
3. Application range:
• Electrostatic protection of semiconductor wafers during handling, packaging, and testing.
• Used as an isolation layer when stacking wafers or loading wafer boxes to prevent electrostatic generation from contact between wafers.
• Suitable for semiconductor manufacturing, microelectronics packaging, flat panel displays, solar cells, and other fields.
4. Usage and maintenance:
• Ensure good contact between the isolation film and the wafer surface during use, and effectively connect to the grounding system if necessary to ensure effective static discharge.
• Maintain a clean environment during storage and use to avoid contamination and mechanical damage.
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