HSB 001 Black Conductive Packaging Bag
HSB 001 Black Conductive Packaging Bag
HSB 001 Black Conductive Packaging Bag
HSB 001 Black Conductive Packaging Bag
HSB 001 Black Conductive Packaging Bag
HSB 001 Black Conductive Packaging Bag
HSB 001 Black Conductive Packaging Bag
HSB 001 Black Conductive Packaging Bag
HSB 001 Black Conductive Packaging Bag
HSB 001 Black Conductive Packaging Bag
HSB 001 Black Conductive Packaging Bag
+
  • HSB 001 Black Conductive Packaging Bag
  • HSB 001 Black Conductive Packaging Bag
  • HSB 001 Black Conductive Packaging Bag
  • HSB 001 Black Conductive Packaging Bag
  • HSB 001 Black Conductive Packaging Bag
  • HSB 001 Black Conductive Packaging Bag
  • HSB 001 Black Conductive Packaging Bag
  • HSB 001 Black Conductive Packaging Bag
  • HSB 001 Black Conductive Packaging Bag
  • HSB 001 Black Conductive Packaging Bag
  • HSB 001 Black Conductive Packaging Bag

HSB 001 Black Conductive Packaging Bag

  • Detailed description
  • Hengsheng black conductive bags are made of black nano-conductive polymer materials, possessing excellent electrostatic discharge and mechanical properties. Processed using a blown film process, the superconductive nano carbon black and polyolefin carrier are perfectly blended with antioxidants, stabilizers, coupling agents, and compatibilizers, resulting in a stable structure, uniform resistance value, and smooth surface. Compared to market printing and casting processes, it offers unique advantages such as easy storage, non-fading, oxidation resistance, and lower cost.

    Name: Black Conductive Packaging Bag
    Model: HSB-001
    Material: ESD PE
    Size: 0.08*300 (opening)*400mm / 0.08*100 (opening)*340mm
    Color: Matte/Single-color printing
    Thickness: Single layer thickness 0.08mm
    Surface Resistance: 10E3-5
    Application: Protective packaging for electronic PCBs and integrated circuits

    Hengsheng's conductive bags are widely used in: dust-free workshops, cleanrooms, optoelectronic factories, LED factories, PCB factories, electronics factories, electrical appliance factories, electronic instruments, wafers,
    LCD/LCM/LED, optoelectronics, semiconductor chips, laser heads, pharmaceuticals and chemicals, precision instruments, medical and healthcare equipment, microelectronics, aerospace,
    military industry, electronic components, optoelectronic products, electronic devices, liquid crystal products, optoelectronic integrated products, and other products in the aerospace manufacturing industry that require ESD and cleanroom standards for production packaging, protection, and isolation.