HESION showcased at SEMI-e 2025, empowering the semiconductor industry chain with innovative technologies
Release Time:
2025.07.02
Showcasing at SEMI-e 2025: Empowering the Semiconductor Industry Chain with Innovative Technologies
From September 10-12, 2025, the global semiconductor industry's attention will be focused on the Shenzhen International Convention and Exhibition Center (Bao'an New Venue), where the 7th Shenzhen International Semiconductor Technology and Application Exhibition (SEMI-e 2025) will be grandly held. As a leading enterprise in the field of anti-static and cleanroom solutions, Dongguan Hengsheng Anti-static Products Co., Ltd. (hereinafter referred to as "Hengsheng") will showcase its newly developed wafer protection solutions and high-end anti-static products, joining over 900 industry pioneers to jointly paint a blueprint for the future of semiconductor technology.
September 10-12, 2025, 7th Shenzhen International Semiconductor Exhibition
Hengsheng Company: Deeply Cultivating the Anti-static Field, Promoting Safe Semiconductor Manufacturing
Since its establishment in 2003, Hengsheng has always focused on the research and development and production of anti-static products, cleanroom supplies, and high-performance films. It is a national high-tech enterprise. The company has a Class 100/1000 cleanroom and advanced production equipment. Its products cover anti-static packaging materials (such as ultra-clean PE bags, shielding bags, conductive foam bags), wafer protection solutions, and electrostatic protective products, widely used in cutting-edge fields such as semiconductors, electronics, and optical instruments. Its products have passed international certifications such as ISO and ASTM and are exported to markets such as the United States, Canada, and South Korea. It has established long-term cooperation with many globally renowned companies.
Exhibition Highlights: Innovative Technologies Solving Industry Pain Points
At this exhibition, Hengsheng will focus on showcasing its wafer interleaf, wafer separator, and wafer box internal space solutions. These products are specifically designed for the high-precision protection needs of semiconductor manufacturing:
HESION Semiconductor Wafer Isolation Paper
1. High-performance materials ensure safety: Using high-temperature resistant, low-ion contamination polyolefin materials, it combines anti-static, anti-physical damage, and low-dust characteristics, suitable for cleanroom environments, effectively reducing the risk of wafer contamination.
2. Diversified designs to meet needs: Provides surface treatment options such as double-sided embossing and grid textures. Matte and glossy finishes meet different customer preferences, flexibly addressing complex process scenarios.
3. Environmental protection concept throughout: The product uses recyclable materials, conforming to the trend of green manufacturing and contributing to the sustainable development of the semiconductor industry.
In addition, Hengsheng will also showcase its classic products such as wafer boxes, anti-static bags, and conductive foam. These materials can effectively prevent electrostatic accumulation from damaging components during semiconductor packaging and transportation, providing full-process protection for the industry chain.
SEMI-e 2025: A Beacon of Innovation in the Semiconductor Industry
As the largest and most influential semiconductor exhibition in South China, SEMI-e 2025 is expected to attract over 70,000 professional visitors, covering the entire industry chain, including chip design, wafer manufacturing, advanced packaging, and third-generation semiconductors (such as silicon carbide and gallium nitride). More than 50 themed events will be held concurrently with the exhibition, including the Third-Generation Semiconductor Summit Forum and the Artificial Intelligence Chip Development Conference, to discuss technological breakthroughs and market trends in the industry.
Hengsheng's participation not only showcases its technological strength but will also promote the in-depth application of anti-static solutions in semiconductor manufacturing through on-site demonstrations and industry exchanges. The company's technical team will share their research and development experience in wafer protection materials at the booth and discuss how to improve yield and production efficiency through material innovation.
We sincerely invite you to this technological feast
Hengsheng's booth will serve as a bridge connecting technology and needs. Whether you are a manufacturer seeking highly reliable anti-static packaging or an industry partner concerned about green materials, you can find customized solutions here. During the SEMI-e 2025 exhibition, the Hengsheng team will provide one-on-one technical consultations and open channels for cooperation discussions.
Hengsheng Anti-static Company Office Building in 2025
Exhibition Information
Time: September 10-12, 2025
Location: Shenzhen International Convention and Exhibition Center (Bao'an New Venue)
Hengsheng Booth: Please refer to the announcements at the exhibition site.
2025 Integrated Circuit Industry Innovation Exhibition
Contact Us
Tel: 0769-82324106
Email: hesion@foxmail.com
Website: www.dghesion.com
The future of the semiconductor industry requires precise collaboration at every stage. Hengsheng looks forward to joining hands with global partners to safeguard the "core" era with the power of innovation!
For more details and cooperation opportunities regarding the 7th Shenzhen International Semiconductor Technology and Application Exhibition, please visit the Hengsheng booth or visit our website.
SEMI-e 2025 Anti-static Technology Semiconductor Innovation
(This article is provided by Hengsheng Anti-static Marketing Department; some exhibition data is cited from the official SEMI-e release.)
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